IRVS VLSI IDEA INNOVATORS

IRVS VLSI IDEA INNOVATORS
VLSI Project, Embedded Project, Matlab Projects and courses with 100% Placements

Thursday, May 5, 2011

Functional safety poses challenges for semiconductor design

To manage systematic and random failures, vendors have applied functional safety techniques at the system level for decades. As the capability to integrate multiple system-level functions into a single component has increased, there’s been a desire to apply those same practices at the semiconductor component or even subcomponent level.

Although the state of the art in functional safety is not yet well aligned with the state of the art in semiconductors, recent work on the IEC 61508 second edition and ISO 26262 draft standards have brought improvements. Many challenges remain, however.

Texas Instruments and Yogitech, a company that verifies and designs mixed-signal system-on-chip solutions, are working together to solve the challenges in standards committees as well as on new TMS570 microcontroller designs. (See Figure 1 below for an example of current-generation designs.

Standards and analysis

All elements that interact to realize a safety function or contribute to the achievement of a semiconductor safety goal must be considered. Regrettably, the available standards aren’t consistent in application or scope. For example, IEC 61508 makes a general distinction between system design and software design, while ISO 26262 respects separate system, hardware component and software component developments.

So how should we consider reusable subcomponent modules such as an analog/digital converter or processor core? “Hard” modules, such as A/D converters, have a fixed implementation and can easily be developed according to hardware component guidelines. “Soft” modules, such as processor cores, are delivered as source code and have no physical implementation until synthesized into a design.

It is not possible to perform some levels of quantitative safety analysis on the “soft” module until it’s synthesized, as it blurs the line between hardware and software components. Trial synthesis with well-documented targets is thus recommended to allow for the calculation of reference safety metrics, so that potential users can evaluate a module’s suitability for their design.

To ensure functional safety, it is critical to understand the probability of random failure of the elements that constitute a safety function or that achieve a safety goal. In traditional analysis, each component in the safety function is typically treated as a black box, with a monolithic failure rate.

Traditional failure rates are estimated based on reliability models, handbooks, field data and experimental data. Those methods often generate wildly different estimates; deltas of 10x to 1,000x are not uncommon. Such variation can pose significant system integration hurdles.

How can you perform meaningful quantitative safety analysis without component failure rates estimated to the same assumptions? One solution is to standardize estimation of failure rates based on a single generic model, such as the one presented in IEC TR 62380 (currently considered in the ISO 26262 draft guidelines). Another is to focus on ratiometric safety analyses—calculations that compare ratios of detected faults to total faults, instead of focusing on the absolute magnitude of failure rate.



This information is shared by www.irvs.info

Monday, May 2, 2011

Quantenna debuts 802.11n 4x4 MIMO wireless video bridge ref design

The QHS600 was announced (see EE Times story in October 2008 and is a single-chip, 5-GHz solution capable of 600-Mbit/s connections that integrates baseband, media access control (MAC) and four RF transceivers, along with their respective power amplifiers, low-noise amplifiers and Tx/Rx switches.

However, according to David French, CEO of Quantenna, "Of more value is the digital beamforming hardware with on-chip DSP doing real-time characterization of the Wi-Fi channel to perform [signal] steering on a packet-by-packet basis." The DSP is an ARC 4 and in all there are 14 patents around this area, he added. Other features include concurrent dual-band mode and mesh networking. According to French, it should be under $10 by the end of 2010.

The newly announced reference design kit (RDK), dubbed the QHS600x, consists of a radio GMII module connected via a mPCI connector to a host adapter board and enables straightforward board boot, bring up and program execution. It also includes integrated functions for various I/O interfaces, including gigabit Ethernet, DDR SDRAM, flash, USB 2.0 OTG, ARM JTAG debug port, GPIOs, serial port and four antenna ports.



Also included is a complete software developer's kit (SDK) that implements the entire networking and device discovery/connectivity functionality required for a wireless video bridge module supporting the 802.11n standard. Additionally, Quantenna and LitePoint have worked together to provide a full test suite of specialized video-over-wireless radio frequency (RF) calibration and performance-characterization software.

According to French, Quantenna will introduce a video bridge at CES and he sees as strong play for its technology with service providers. The company already has a deal with Swisscom, one of its backers, as well as eight other providers, unnamed as yet.

Information is shared by www.irvs.info